PCB plating zero defects! Electronic grade defoamer escort precision manufacturing




In the plating process of printed circuit board (PCB), foaming of plating solution can lead to fatal defects such as uneven coating in the hole and short circuit. The traditional defoamer is easy to retain particles and affect the line impedance. Electronic grade polyether modified defoamer, with "ultra-pure, zero particle" characteristics, has been certified by SEMI to become the invisible guardian of high-end electronic manufacturing.


1. Micro-disaster of electroplating foam
Hole wall cavity: foam blocks copper deposition, and the through hole resistance exceeds the standard rate by 15%;


Short circuit risk: the bubble burst to produce metal splash, line spacing < 50μm yield decreased by 30%;


Cost surge: each 8-layer board due to defect scrap loss of 80 yuan.


Second, product performance benchmark
Purity > 99.99% : metal ion content < 1ppm, up to G3 grade;


Particle size control: D90 < 0.2μm to avoid clogging of filter element;


Strong acid resistance: Stable operation > 6 months in copper sulfate bath.


Third, 5G base station PCB mass production demonstration
Process challenge: A company produced 0.1mm aperture HDI board, due to foam resulting in uneven copper thickness of the hole wall (target 18±2μm, the actual fluctuation of ±5μm).
Technical solution: Add 5ppm defoamer in the copper plating tank, and cooperate with circulation filtration.
Comparison of results:


The uniformity of pore copper was improved to ±1.5μm.


Impedance consistency increased from 85% to 98%;


The monthly scrap rate was reduced from 3.7% to 0.4%, and the annual cost savings were 12 million yuan.