Application of Silicone Pouring Adhesive in Automotive Electronics


Silicone applications in automotive electronic devices include adhesives and sealants, potting adhesives, gels, insulation coatings, thermal conductive adhesives and other materials. These materials are used to protect engine control module, ignition wire and ignition module, power system module, brake system module, exhaust emission control module, power supply system, lighting system, various sensors, connectors and so on.


Pouring glue is generally used in all kinds of control modules, and the components are generally poured in order to achieve the basic requirements of moisture-proof, anti-fouling and anti-corrosion. Silicone sealant can reduce stress and withstand high and low temperature impact. For the high power control module, thermal conductive sealing glue is used to achieve the function of heat dissipation.


Organosilicon filling materials are widely used in wiper controller and power system module. The filling of HID (High Intensity Discharge) lamp module is a typical application. HID module includes igniter and converter. The filling glue used must have good bonding performance and excellent dielectric properties, can prevent dust and water seepage, play an adequate role in insulation protection; the filling glue must be relatively soft, can prevent the solder joint from falling off; because there are some heating elements in the module, the filling glue needs to have a certain thermal conductivity.


With the continuous development of high-end industries, in order to ensure the stability and durability of equipment in the automotive industry, the reliability of equipment will be reduced by eliminating the influence of environmental factors (moisture, salt fog, dust, vibration, heat, etc.), and more stringent requirements are put forward for silicone materials.


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