Thermal Conduction Mechanism of Silicone Thermal Conductive Adhesive
According to the different carriers of heat conduction in matter, the heat conduction mechanism of matter can be divided into: (1) electronic heat conduction; (2) phonon heat conduction; (3) photon heat conduction; (4) molecular heat conduction. The corresponding heat conduction carriers are electrons, phonons, photons and molecules in turn. Unlike metal and inorganic non-metallic materials, most polymers are saturated systems, so there are no free electrons. At the same time, the movement of molecules in polymers is relatively difficult. Therefore, their thermal conductivity is mainly through the lattice vibration, so phonon is the main heat conducting carrier of polymers; however, due to polymer chains, phonon is the main heat conducting carrier of polymers. Irregular entanglement results in low crystallinity, so there is a large amorphous part. At present, many commonly used polymer materials (such as polyvinyl chloride, cellulose, polyester, etc.) belong to crystalline or amorphous materials. Their complete molecular chains can not move freely, only the vibration of atoms, groups (or chains) occurs. Therefore, the thermal conductivity of polymers is generally unsatisfactory. At present, the preparation principle of thermal conductive polymer composites is mainly through phonon heat conduction between fillers to achieve heat conduction, which is usually achieved by adding thermal conductive fillers to the matrix.
Application of Silicone Thermal Conductive Adhesive=
Silicone thermal conductive adhesive is especially suitable for power supply industry because of its excellent thermal conductivity, heat dissipation, insulation, heat resistance and chemical erosion resistance, weather resistance, strong adhesion and other factors.
The scope of power industry is very large, because there are power supply problems in all electrical products, because different products require different voltages and currents. In the early years, chloroprene (yellow glue) was used to fix it, but yellow glue was solidified by volatilization of solvents, which led to the extremely high VOC (VOC is the abbreviation of volatile organic compounds, commonly referred to as harmful chemicals in latex paint) which has a great impact on the environment, low temperature resistance, and will automatically lose over time. Debonding, and silicone thermal conductive silica gel and silicone thermal conductive filling glue do not exist these problems. Construction Notices of Silicone Thermal Conductive Adhesive=
1. Clean up the surface of the sticky or coated material, remove rust, dust and grease, etc.
2. Turn off the cap of the hose and squeeze the glue onto the cleaned surface to make it evenly distributed, and then close and fix the adhesive surface.
3. Place the bonded or sealed parts in the air and let them solidify naturally.
The curing process is a surface-to-interior curing process. Within 24 hours (room temperature and 50% relative humidity), the adhesive will be cured at a depth of 2-4 mm. If the position is deep, especially where it is not easy to touch the air, the time of complete curing will be prolonged. If the temperature is lower, the curing time will also be prolonged, and it will be further treated or sticked. Before packaging the knotted parts, it is recommended that the user wait long enough to ensure the firmness and integrity of the bonding is not affected. Notes: After the operation is completed, the unused glue should tighten the cap immediately, seal and preserve, and when it is used again, if there is a little crust at the seal, it can be removed without affecting the normal use.
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