Thermal conductive silica gel includes room temperature vulcanization and high temperature vulcanization.
It is mainly used for elastic bonding, heat dissipation, insulation and sealing in electronics, electrical appliances, instrumentation and other industries (it can provide high elasticity and heat resistance required by the system, and can quickly transfer the heat of the system). Usually, the thermal conductivity of high temperature vulcanized silica gel is higher than that of room temperature vulcanized silica gel. High temperature vulcanized silica gel is mainly used as gasket or radiator. Room temperature vulcanized silica gel is mainly used for bonding and encapsulation of heat dissipating parts in electronic and household appliances industries.

As a silicone rubber matrix with excellent insulation and shock absorption performance, its thermal conductivity is only about 0.2W/(mK). However, the thermal conductivity of silicone rubber matrix can be several times higher by adding high performance thermal conductive fillers, including metal fillers (such as Al, Cu, MgO, AIN, BN) and non-metallic materials (such as SiC, graphite, carbon black, etc.). Even tens of times higher. The thermal conductivity of thermal conductive silica gel material is ultimately determined by the matrix, filler performance, filler proportion, filler distribution, processing technology and so on.

The most common thermal conductive encapsulated silica gel is composed of two components (A and B components), including additive or condensation silicone rubber. The additive silicone rubber can be deep encapsulated and there is no low molecular weight substance in the curing process. The shrinkage rate is very low. It has good adhesion to the components or the wall of the encapsulation chamber. The higher contraction rate of the condensation type has a lower adhesion to the cavity components.

One-component heat-conductive filling silicone rubber also includes condensation type and addition type. Condensation type generally has good adhesion to the substrate, but only suitable for shallow filling. One-component heat-conductive silicone rubber generally needs low temperature (refrigerator preservation), after filling, it needs to be cured by heating.