It is understood that in LED lamps, 30% to 35% of the power is converted into light energy during normal operation, and another 65% to 70% is converted into heat. Due to the temperature sensitivity of the LED panel light, in general, the LED will be fortunate to avoid performance degradation or failure below the junction temperature of 125 ° C. 70% of the LED faults are caused by excessive temperature and the load is half of the rated power. For every 20 °C rise in temperature, the failure rate doubles.
   There are three basic links in the heat conduction of LED lamps, from chip to epitaxy, to the package substrate, to the heat sink or the case. At present, the LED cooling technology problem is that the LED node is limited by temperature. Under normal circumstances, the maximum temperature is 125 degrees Celsius; the design value is 90 degrees Celsius, and the ambient air temperature difference is only 55 degrees Celsius.
        Continued high temperatures result in reduced lifetimes of LED chips, phosphors, and encapsulating resins. In order to maintain the advantages of "high efficiency" and "long life" of LEDs, it is necessary to control the junction temperature of the LEDs. Therefore, the choice of thermal conductive materials (thermal grease, thermal silica gel, etc.) to solve the problem of heat dissipation technology is particularly important. Among them, the choice of thermal conductive material is the LED panel light must be taken into consideration at the beginning of design, which is the most basic step. Therefore, the choice of thermal conductive material is also the first step of high efficiency and long life of LED lighting.
        Since the LED panel light cannot be cooled by a fan or a natural convection heat dissipation method, the LED heat dissipation design must also meet the optical requirements of the LED lighting fixture. In addition, the LED heat dissipation design must also meet the needs of the luminaire modeling. Only in this way, LED lighting has a better selling point, and the luminaire styling limits the LED heat dissipation design.
        Because the cost of LED heat dissipation is very high, the size and weight limit LED lighting fixtures can not fill a large number of high thermal conductivity thermal materials, which is the most cost-effective thermal silica gel, is the first choice for thermal and thermal materials.